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[n]	B. Cheymol, “Effects of Energy Deposition Models and Conductive Cooling on Wire Scanner Thermal Load, Analytical and Finite Element Analysis Approach”, in Proc. HB'16, Malmö, Sweden, Jul. 2016, pp. 221-225. doi:10.18429/JACoW-HB2016-MOPL016

For LaTeX

%\cite{Cheymol:HB16-MOPL016} \bibitem{Cheymol:HB16-MOPL016} B. Cheymol, \textquotedblleft{Effects of Energy Deposition Models and Conductive Cooling on Wire Scanner Thermal Load, Analytical and Finite Element Analysis Approach}\textquotedblright, in \emph{Proc. HB’16}, Malmö, Sweden, Jul. 2016, pp. 221--225. \url{doi:10.18429/JACoW-HB2016-MOPL016}

For BibTeX

@inproceedings{cheymol:hb16-mopl016, author = {B. Cheymol}, title = {{Effects of Energy Deposition Models and Conductive Cooling on Wire Scanner Thermal Load, Analytical and Finite Element Analysis Approach}}, booktitle = {Proc. HB'16}, pages = {221--225}, paper = {MOPL016}, venue = {Malmö, Sweden, Jul. 2016}, publisher = {JACoW Publishing, Geneva, Switzerland}, doi = {10.18429/JACoW-HB2016-MOPL016}, url = {https://jacow.org/hb2016/papers/MOPL016.pdf}, language = {english} }

References

• B. Cheymol, “Effects of Energy Deposition Models and Conductive Cooling on Wire Scanner Thermal Load, Analytical and Finite Element Analysis Approach”, in Proc. 57th ICFA Advanced Beam Dynamics Workshop on High-Intensity and High-Brightness Hadron Beams (HB'16), Malmö, Sweden, Jul. 2016, pp. 221-225.