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[n]	M. Renier, D. Schmied, and B. A. Trickett, “Vacuum System of the ESRF”, in Proc. EPAC'92, Berlin, Germany, Mar. 1992, pp. 135-138. 

[n]	V. Candela et al., “Additive Manufacturing of 6 GHz seamless SRF copper cavities: printing, surface treatments and performance investigations”, in Proc. IPAC'23, Venice, Italy, May 2023, pp. 4943-4946. doi:10.18429/JACoW-IPAC2023-THPM023

For LaTeX

%\cite{Renier:EPAC92} \bibitem{Renier:EPAC92} M. Renier, D. Schmied, and B. A. Trickett, \textquotedblleft{Vacuum System of the ESRF}\textquotedblright, in \emph{Proc. EPAC’92}, Berlin, Germany, Mar. 1992, pp. 135--138. %\cite{VC:IPAC23-THPM023} \bibitem{VC:IPAC23-THPM023} V. Candela \emph{et al.}, \textquotedblleft{Additive Manufacturing of 6 GHz seamless SRF copper cavities: printing, surface treatments and performance investigations}\textquotedblright, in \emph{Proc. IPAC’23}, Venice, Italy, May 2023, pp. 4943--4946. \doi{10.18429/JACoW-IPAC2023-THPM023}

For BibTeX

@inproceedings{renier:epac92, author = {M. Renier and D. Schmied and B. A. Trickett}, title = {{Vacuum System of the ESRF}}, booktitle = {Proc. EPAC'92}, pages = {135--138}, paper = {}, venue = {Berlin, Germany, Mar. 1992}, series = {European Particle Accelerator Conference}, number = {3}, publisher = {JACoW Publishing, Geneva, Switzerland}, language = {english} } @inproceedings{vc:ipac23-thpm023, author = {V. Candela and others}, title = {{Additive Manufacturing of 6 GHz seamless SRF copper cavities: printing, surface treatments and performance investigations}}, booktitle = {Proc. IPAC'23}, pages = {4943--4946}, paper = {THPM023}, venue = {Venice, Italy}, series = {International Particle Accelerator Conference}, number = {14}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {9}, year = {2023}, issn = {2673-5490}, isbn = {978-3-95-450231-8}, doi = {10.18429/JACoW-IPAC2023-THPM023}, language = {english} }

References

• M. Renier, D. Schmied, and B. A. Trickett, “Vacuum System of the ESRF”, in Proc. 3rd European Particle Accelerator Conf. (EPAC'92), Berlin, Germany, Mar. 1992, pp. 135-138.
• V. Candela et al., “Additive Manufacturing of 6 GHz seamless SRF copper cavities: printing, surface treatments and performance investigations”, in Proc. 14th Int. Particle Accelerator Conf. (IPAC'23), Venice, Italy, May 2023, paper THPM023, pp. 4943-4946.