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[n]	A. T. Wu et al., “Buffered Electropolishing ÔÇô A New Way for Achieving Extremely Smooth Surface Finish on Nb SRF Cavities to be Used in Particle Accelerators”, in Proc. PAC'09, Vancouver, Canada, May 2009, paper WE5PFP060, pp. 2141-2143. 

For LaTeX

%\cite{Wu:PAC09-WE5PFP060} \bibitem{Wu:PAC09-WE5PFP060} A. T. Wu \emph{et al.}, \textquotedblleft{Buffered Electropolishing ÔÇô A New Way for Achieving Extremely Smooth Surface Finish on Nb SRF Cavities to be Used in Particle Accelerators}\textquotedblright, in \emph{Proc. PAC’09}, Vancouver, Canada, May 2009, paper WE5PFP060, pp. 2141--2143.

For BibTeX

@inproceedings{wu:pac09-we5pfp060, author = {A. T. Wu and others}, title = {{Buffered Electropolishing ÔÇô A New Way for Achieving Extremely Smooth Surface Finish on Nb SRF Cavities to be Used in Particle Accelerators}}, booktitle = {Proc. PAC'09}, pages = {2141--2143}, paper = {WE5PFP060}, venue = {Vancouver, Canada, May 2009}, series = {Particle Accelerator Conference}, number = {23}, publisher = {JACoW Publishing, Geneva, Switzerland}, url = {https://jacow.org/PAC2009/papers/WE5PFP060.pdf}, language = {english} }

References

• A. T. Wu et al., “Buffered Electropolishing ÔÇô A New Way for Achieving Extremely Smooth Surface Finish on Nb SRF Cavities to be Used in Particle Accelerators”, in Proc. 23rd Particle Accelerator Conf. (PAC'09), Vancouver, Canada, May 2009, paper WE5PFP060, pp. 2141-2143.