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[n]	M. Huck, J. Bahrdt, H. Huck, A. Meseck, and M. Ries, “Transverse Broad-band Impedance Studies of the New In-vacuum Cryogenic Undulator at Bessy II Storage Ring”, in Proc. IBIC'20, Santos, Brazil, Sep. 2020, pp. 263-267. doi:10.18429/JACoW-IBIC2020-THPP26

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