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For Word

[n]	C. C. Jensen, “Extraction Kicker Pulser Design for Main Injector”, in Proc. PAC'09, Vancouver, Canada, May 2009, paper TU6RFP078, pp. 1732-1732. 

[n]	Y. Okii et al., “R&D of Copper Electroplating Process for Power Couplers: Effect of Microstructures on RRR”, in Proc. SRF'19, Dresden, Germany, Jun.-Jul. 2019, pp. 278-281. doi:10.18429/JACoW-SRF2019-MOP083

For LaTeX

%\cite{Jensen:PAC09-TU6RFP078} \bibitem{Jensen:PAC09-TU6RFP078} C. C. Jensen, \textquotedblleft{Extraction Kicker Pulser Design for Main Injector}\textquotedblright, in \emph{Proc. PAC’09}, Vancouver, Canada, May 2009, paper TU6RFP078, pp. 1732--1732. %\cite{Okii:SRF19-MOP083} \bibitem{Okii:SRF19-MOP083} Y. Okii \emph{et al.}, \textquotedblleft{R&D of Copper Electroplating Process for Power Couplers: Effect of Microstructures on RRR}\textquotedblright, in \emph{Proc. SRF’19}, Dresden, Germany, Jun.-Jul. 2019, pp. 278--281. \doi{10.18429/JACoW-SRF2019-MOP083}

For BibTeX

@inproceedings{jensen:pac09-tu6rfp078, author = {C. C. Jensen}, title = {{Extraction Kicker Pulser Design for Main Injector}}, booktitle = {Proc. PAC'09}, pages = {1732--1732}, paper = {TU6RFP078}, venue = {Vancouver, Canada, May 2009}, series = {Particle Accelerator Conference}, number = {23}, publisher = {JACoW Publishing, Geneva, Switzerland}, url = {https://jacow.org/PAC2009/papers/TU6RFP078.pdf}, language = {english} } @inproceedings{okii:srf19-mop083, author = {Y. Okii and others}, title = {{R&D of Copper Electroplating Process for Power Couplers: Effect of Microstructures on RRR}}, booktitle = {Proc. SRF'19}, pages = {278--281}, paper = {MOP083}, venue = {Dresden, Germany, Jun.-Jul. 2019}, publisher = {JACoW Publishing, Geneva, Switzerland}, doi = {10.18429/JACoW-SRF2019-MOP083}, url = {https://jacow.org/srf2019/papers/MOP083.pdf}, language = {english} }

References

• C. C. Jensen, “Extraction Kicker Pulser Design for Main Injector”, in Proc. 23rd Particle Accelerator Conf. (PAC'09), Vancouver, Canada, May 2009, paper TU6RFP078, pp. 1732-1732.
• Y. Okii et al., “R&D of Copper Electroplating Process for Power Couplers: Effect of Microstructures on RRR”, in Proc. 19th Int. Conf. RF Superconductivity (SRF'19), Dresden, Germany, Jun.-Jul. 2019, pp. 278-281.