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Author: O. Azzolini


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Reference
C. Pira et al., “Plasma Electrolytic Polishing as a Promising Treatment Replacement of Electropolishing in the Copper and Niobium Substrate Preparation for SRF”, in Proc. 20th International Conference on RF Superconductivity (SRF'21), East Lansing, MI, USA, Jun.-Jul. 2021, pp. 718.
C. Pira et al., “Progress in European Thin Film Activities”, presented at the 21th Int. Conf. RF Superconductivity (SRF'23), Grand Rapids, MI, USA, Jun. 2023, paper WECAA01, unpublished.
C. Pira et al., “Progress of application and surface enhancement by Plasma Electrolytic Polishing as a new treatment for SRF substrates and accelerator components preparation”, presented at the 14th Int. Particle Accelerator Conf. (IPAC'23), Venice, Italy, May 2023, paper THPM036, unpublished.
D. Fonnesu et al., “Influence of the Coating Parameters on the Tc of Nb₃Sn Thin Films on Copper Deposited via DC Magnetron Sputtering”, presented at the 21th Int. Conf. RF Superconductivity (SRF'23), Grand Rapids, MI, USA, Jun. 2023, paper MOPMB013, unpublished.
D. Giove et al., “A high brightness beam test facility for ERL applications”, in Proc. 14th Int. Particle Accelerator Conf. (IPAC'23), Venice, Italy, May 2023, paper TUPL164, pp. 2127-2130.
E. Chyhyrynets et al., “Application of Plasma Electrolytic Polishing onto SRF Substrates”, in Proc. 20th International Conference on RF Superconductivity (SRF'21), East Lansing, MI, USA, Jun.-Jul. 2021, pp. 116.
E. Chyhyrynets et al., “Cu/Nb QPR Surface Preparation Protocol in the Framework of ARIES Project”, in Proc. 20th International Conference on RF Superconductivity (SRF'21), East Lansing, MI, USA, Jun.-Jul. 2021, pp. 121.
E. Chyhyrynets et al., “Plasma Electrolytic Polishing Technology Progress Development for Nb and Cu Substrates Preparation”, presented at the 21th Int. Conf. RF Superconductivity (SRF'23), Grand Rapids, MI, USA, Jun. 2023, paper MOPMB009, unpublished.
E. Chyhyrynets et al., “Vibro-tumbling as an Alternative to Standard Mechanical Polishing Techniques for SRF Cavities”, in Proc. 19th Int. Conf. RF Superconductivity (SRF'19), Dresden, Germany, Jun.-Jul. 2019, pp. 464-466.
F. Sciarrabba et al., “1.3 GHz Seamless Copper Cavities via CNC Spinning Technique”, in Proc. 20th International Conference on RF Superconductivity (SRF'21), East Lansing, MI, USA, Jun.-Jul. 2021, pp. 440.


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