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[n]	R. L. York and R. R. Stevens, “A Cusped Field H- Ion Source for LAMPF”, in Proc. PAC'83, Santa Fe, NM, USA, Mar. 1983, pp. 2705-2708. 

[n]	K. Mittag, R. Hietschold, B. Piosczyk, and J. E. Vetter, “Measurements of Loss Tangent of Dielectric Materials at Low Temperatures”, in Proc. LINAC'70, Batavia, IL, USA, Sep.-Oct. 1970, paper D-3, pp. 257-263. 

For LaTeX

%\cite{York:PAC83} \bibitem{York:PAC83} R. L. York and R. R. Stevens, \textquotedblleft{A Cusped Field H^- Ion Source for LAMPF}\textquotedblright, in \emph{Proc. PAC’83}, Santa Fe, NM, USA, Mar. 1983, pp. 2705--2708. %\cite{Mittag:LINAC70-D-3} \bibitem{Mittag:LINAC70-D-3} K. Mittag, R. Hietschold, B. Piosczyk, and J. E. Vetter, \textquotedblleft{Measurements of Loss Tangent of Dielectric Materials at Low Temperatures}\textquotedblright, in \emph{Proc. LINAC’70}, Batavia, IL, USA, Sep.-Oct. 1970, paper D--3, pp. 257--263.

For BibTeX

@inproceedings{york:pac83, author = {R. L. York and R. R. Stevens}, title = {{A Cusped Field H^- Ion Source for LAMPF}}, booktitle = {Proc. PAC'83}, pages = {2705--2708}, paper = {}, venue = {Santa Fe, NM, USA, Mar. 1983}, publisher = {JACoW Publishing, Geneva, Switzerland}, language = {english} } @inproceedings{mittag:linac70-d-3, author = {K. Mittag and R. Hietschold and B. Piosczyk and J. E. Vetter}, title = {{Measurements of Loss Tangent of Dielectric Materials at Low Temperatures}}, booktitle = {Proc. LINAC'70}, pages = {257--263}, paper = {D-3}, venue = {Batavia, IL, USA, Sep.-Oct. 1970}, series = {Linear Accelerator Conference}, publisher = {JACoW Publishing, Geneva, Switzerland}, url = {https://jacow.org/l70/papers/D-3.pdf}, language = {english} }

References

• R. L. York and R. R. Stevens, “A Cusped Field H^- Ion Source for LAMPF”, in Proc. 10th Particle Accelerator Conf. (PAC'83), Santa Fe, NM, USA, Mar. 1983, pp. 2705-2708.
• K. Mittag, R. Hietschold, B. Piosczyk, and J. E. Vetter, “Measurements of Loss Tangent of Dielectric Materials at Low Temperatures”, in Proc. 1970 Linear Accelerator Conf. (LINAC'70), Batavia, IL, USA, Sep.-Oct. 1970, paper D-3, pp. 257-263.