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[n]	V. Danielyan et al., “Copper Accelerating Structure Fabrication With Controled Cu-Ag Joining Conditions”, in Proc. IPAC'17, Copenhagen, Denmark, May 2017, pp. 4104-4107. doi:10.18429/JACoW-IPAC2017-THPIK001

For LaTeX

%\cite{Danielyan:IPAC17-THPIK001} \bibitem{Danielyan:IPAC17-THPIK001} V. Danielyan \emph{et al.}, \textquotedblleft{Copper Accelerating Structure Fabrication With Controled Cu-Ag Joining Conditions}\textquotedblright, in \emph{Proc. IPAC’17}, Copenhagen, Denmark, May 2017, pp. 4104--4107. \url{doi:10.18429/JACoW-IPAC2017-THPIK001}

For BibTeX

@inproceedings{danielyan:ipac17-thpik001, author = {V. Danielyan and others}, title = {{Copper Accelerating Structure Fabrication With Controled Cu-Ag Joining Conditions}}, booktitle = {Proc. IPAC'17}, pages = {4104--4107}, paper = {THPIK001}, venue = {Copenhagen, Denmark, May 2017}, publisher = {JACoW Publishing, Geneva, Switzerland}, doi = {10.18429/JACoW-IPAC2017-THPIK001}, url = {https://jacow.org/ipac2017/papers/THPIK001.pdf}, language = {english} }

References

• V. Danielyan et al., “Copper Accelerating Structure Fabrication With Controled Cu-Ag Joining Conditions”, in Proc. 8th Int. Particle Accelerator Conf. (IPAC'17), Copenhagen, Denmark, May 2017, pp. 4104-4107.