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[n]	J. Upadhyay, K. Bishofberger, S. Kurennoy, J. Bernardin, J. Lyles, and J. Shoemaker, “Additive manufacturing of copper RF structures for particle accelerator applications”, in Proc. IPAC'23, Venice, Italy, May 2023, pp. 53-55. doi:10.18429/JACoW-IPAC2023-MOOG3

For LaTeX

%\cite{Upadhyay:IPAC23-MOOG3} \bibitem{Upadhyay:IPAC23-MOOG3} J. Upadhyay, K. Bishofberger, S. Kurennoy, J. Bernardin, J. Lyles, and J. Shoemaker, \textquotedblleft{Additive manufacturing of copper RF structures for particle accelerator applications}\textquotedblright, in \emph{Proc. IPAC’23}, Venice, Italy, May 2023, pp. 53--55. \url{doi:10.18429/JACoW-IPAC2023-MOOG3}

For BibTeX

@inproceedings{upadhyay:ipac23-moog3, author = {J. Upadhyay and K. Bishofberger and S. Kurennoy and J. Bernardin and J. Lyles and J. Shoemaker}, title = {{Additive manufacturing of copper RF structures for particle accelerator applications}}, booktitle = {Proc. IPAC'23}, pages = {53--55}, paper = {MOOG3}, venue = {Venice, Italy}, series = {International Particle Accelerator Conference}, number = {14}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {9}, year = {2023}, issn = {2673-5490}, isbn = {978-3-95-450231-8}, doi = {10.18429/JACoW-IPAC2023-MOOG3}, language = {english} }

References

• J. Upadhyay, K. Bishofberger, S. Kurennoy, J. Bernardin, J. Lyles, and J. Shoemaker, “Additive manufacturing of copper RF structures for particle accelerator applications”, in Proc. 14th Int. Particle Accelerator Conf. (IPAC'23), Venice, Italy, May 2023, paper MOOG3, pp. 53-55.