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[n]	Y. Yang, S. Kelham, S. Kim, W. Liu, and J. Power, “Eom-based bunch arrival monitor development at the Argonne wakefield accelerator facility”, in Proc. IPAC'23, Venice, Italy, May 2023, pp. 4112-4114. doi:10.18429/JACoW-IPAC2023-THPA064

For LaTeX

%\cite{Yang:IPAC23-THPA064} \bibitem{Yang:IPAC23-THPA064} Y. Yang, S. Kelham, S. Kim, W. Liu, and J. Power, \textquotedblleft{Eom-based bunch arrival monitor development at the Argonne wakefield accelerator facility}\textquotedblright, in \emph{Proc. IPAC’23}, Venice, Italy, May 2023, pp. 4112--4114. \url{doi:10.18429/JACoW-IPAC2023-THPA064}

For BibTeX

@inproceedings{yang:ipac23-thpa064, author = {Y. Yang and S. Kelham and S. Kim and W. Liu and J. Power}, title = {{Eom-based bunch arrival monitor development at the Argonne wakefield accelerator facility}}, booktitle = {Proc. IPAC'23}, pages = {4112--4114}, paper = {THPA064}, venue = {Venice, Italy}, series = {International Particle Accelerator Conference}, number = {14}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {9}, year = {2023}, issn = {2673-5490}, isbn = {978-3-95-450231-8}, doi = {10.18429/JACoW-IPAC2023-THPA064}, language = {english} }

References

• Y. Yang, S. Kelham, S. Kim, W. Liu, and J. Power, “Eom-based bunch arrival monitor development at the Argonne wakefield accelerator facility”, in Proc. 14th Int. Particle Accelerator Conf. (IPAC'23), Venice, Italy, May 2023, paper THPA064, pp. 4112-4114.