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[n]	L. Zhao, G. Cheng, G. Ciovati, and K. M. Wilson, “Copper Plating Qualification Process for the Fundamental Power Coupler Waveguides for CEBAF Cryomodules”, in Proc. SRF'23, Grand Rapids, MI, USA, Jun. 2023, pp. 790-793. doi:10.18429/JACoW-SRF2023-WEPWB087
[n]	S. G. Seddon-Stettler, M. Liepe, T. E. Oseroff, N. Sitaraman, and Z. Sun, “Surface Characterization Studies of Gold-Plated Niobium”, in Proc. SRF'23, Grand Rapids, MI, USA, Jun. 2023, pp. 290-292. doi:10.18429/JACoW-SRF2023-MOPMB076
[n]	P. Kolb et al., “Temperature Mapping for Coaxial Cavities at TRIUMF”, in Proc. SRF'23, Grand Rapids, MI, USA, Jun. 2023, pp. 183-186. doi:10.18429/JACoW-SRF2023-MOPMB038
[n]	Y. Yamamoto, T. Matsumoto, and S. Michizono, “Development and Evaluation of STF-Type Power Coupler for Cost Reduction at the High Energy Accelerator Research Organization”, in Proc. SRF'23, Grand Rapids, MI, USA, Jun. 2023, pp. 820-822. doi:10.18429/JACoW-SRF2023-WEPWB098

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