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The page numbers for some of these references could not be added automatically. You must provide the page numbers from the original proceedings which is located at JACoW.org, and substitute ‘pp. XX-XX’ with the correct page numbers.
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[n] L. Zytniak, K. Fugiel, K. Klimczyk, S. Kupiecki, and T. Madej, “AI-driven device driver generator”, in Proc. ICALEPCS'25, Chicago, IL, USA, Sep. 2025, pp. 1176-1180. doi:10.18429/JACoW-ICALEPCS2025-WEPD060
[n] E. Kako, H. Hayano, S. Noguchi, T. Shishido, K. Watanabe, and Y. Yamamoto, “High Power Input Couplers for the STF Baseline Cavity System at KEK”, in Proc. SRF'07, Beijing, China, Oct. 2007, paper TUP60, pp. XX-XX.
[n] P. Schnizer, J. Bengtsson, and W. Sulaiman Khail, “Small Talk on AT”, in Proc. IPAC'22, Bangkok, Thailand, Jun. 2022, pp. 918-921. doi:10.18429/JACoW-IPAC2022-TUPOST029
[n] Y. Yamamoto, T. Matsumoto, and S. Michizono, “Development and Evaluation of STF-Type Power Coupler for Cost Reduction at the High Energy Accelerator Research Organization”, in Proc. SRF'23, Grand Rapids, MI, USA, Jun. 2023, pp. 820-822. doi:10.18429/JACoW-SRF2023-WEPWB098
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References
- L. Zytniak, K. Fugiel, K. Klimczyk, S. Kupiecki, and T. Madej, “AI-driven device driver generator”, in Proc. 20th International Conference on Accelerator and Large Experimental Control Systems (ICALEPCS'25), Chicago, IL, USA, Sep. 2025, pp. 1176-1180.
- E. Kako, H. Hayano, S. Noguchi, T. Shishido, K. Watanabe, and Y. Yamamoto, “High Power Input Couplers for the STF Baseline Cavity System at KEK”, in Proc. 13th Int. Conf. RF Superconductivity (SRF'07), Beijing, China, Oct. 2007, paper TUP60, pp. XX-XX.
- P. Schnizer, J. Bengtsson, and W. Sulaiman Khail, “Small Talk on AT”, in Proc. 13th Int. Particle Accelerator Conf. (IPAC'22), Bangkok, Thailand, Jun. 2022, pp. 918-921.
- Y. Yamamoto, T. Matsumoto, and S. Michizono, “Development and Evaluation of STF-Type Power Coupler for Cost Reduction at the High Energy Accelerator Research Organization”, in Proc. 21th Int. Conf. RF Superconductivity (SRF'23), Grand Rapids, MI, USA, Jun. 2023, paper WEPWB098, pp. 820-822.
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