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[n]	M. Fouaidy and N. Hammoudi, “RRR of Copper Coating and Low Temperature Electrical Resistivity of Material for TTF Couplers”, in Proc. SRF'05, Ithaca, NY, USA, Jul. 2005, paper TUP65, pp. 392-398. 

[n]	H. Padamsee et al., “Does UHV Annealing above 1100C as a Final Surface Treatment Reduce Field Emission Loading in Superconducting Cavities?”, in Proc. LINAC'88, Williamsburg, VA, USA, Oct. 1988, paper WE3-35, pp. 397-399. 

For LaTeX

%\cite{Fouaidy:SRF05-TUP65} \bibitem{Fouaidy:SRF05-TUP65} M. Fouaidy and N. Hammoudi, \textquotedblleft{RRR of Copper Coating and Low Temperature Electrical Resistivity of Material for TTF Couplers}\textquotedblright, in \emph{Proc. SRF’05}, Ithaca, NY, USA, Jul. 2005, paper TUP65, pp. 392--398. %\cite{Padamsee:LINAC88-WE3-35} \bibitem{Padamsee:LINAC88-WE3-35} H. Padamsee \emph{et al.}, \textquotedblleft{Does UHV Annealing above 1100C as a Final Surface Treatment Reduce Field Emission Loading in Superconducting Cavities?}\textquotedblright, in \emph{Proc. LINAC’88}, Williamsburg, VA, USA, Oct. 1988, paper WE3--35, pp. 397--399.

For BibTeX

@inproceedings{fouaidy:srf05-tup65, author = {M. Fouaidy and N. Hammoudi}, title = {{RRR of Copper Coating and Low Temperature Electrical Resistivity of Material for TTF Couplers}}, booktitle = {Proc. SRF'05}, pages = {392--398}, paper = {TUP65}, venue = {Ithaca, NY, USA, Jul. 2005}, publisher = {JACoW Publishing, Geneva, Switzerland}, url = {https://jacow.org/SRF2005/papers/TUP65.pdf}, language = {english} } @inproceedings{padamsee:linac88-we3-35, author = {H. Padamsee and others}, title = {{Does UHV Annealing above 1100C as a Final Surface Treatment Reduce Field Emission Loading in Superconducting Cavities?}}, booktitle = {Proc. LINAC'88}, pages = {397--399}, paper = {WE3-35}, venue = {Williamsburg, VA, USA, Oct. 1988}, series = {Linear Accelerator Conference}, publisher = {JACoW Publishing, Geneva, Switzerland}, url = {https://jacow.org/l88/papers/WE3-35.pdf}, language = {english} }

References

• M. Fouaidy and N. Hammoudi, “RRR of Copper Coating and Low Temperature Electrical Resistivity of Material for TTF Couplers”, in Proc. 12th Int. Conf. RF Superconductivity (SRF'05), Ithaca, NY, USA, Jul. 2005, paper TUP65, pp. 392-398.
• H. Padamsee et al., “Does UHV Annealing above 1100C as a Final Surface Treatment Reduce Field Emission Loading in Superconducting Cavities?”, in Proc. 1988 Linear Accelerator Conf. (LINAC'88), Williamsburg, VA, USA, Oct. 1988, paper WE3-35, pp. 397-399.