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[n]	T. Holubek et al., “A Superconducting Switch for Insertion Devices with Variable Period Length”, in Proc. IPAC'11, San Sebastian, Spain, Sep. 2011, paper THPC160, pp. 3266-3268. 

[n]	E. Kako et al., “Quality Control of Copper Plating in STF-2 Input Power Couplers”, in Proc. SRF'17, Lanzhou, China, Jul. 2017, pp. 186-190. doi:10.18429/JACoW-SRF2017-MOPB061

For LaTeX

%\cite{Holubek:IPAC11-THPC160} \bibitem{Holubek:IPAC11-THPC160} T. Holubek \emph{et al.}, \textquotedblleft{A Superconducting Switch for Insertion Devices with Variable Period Length}\textquotedblright, in \emph{Proc. IPAC’11}, San Sebastian, Spain, Sep. 2011, paper THPC160, pp. 3266--3268. %\cite{Kako:SRF17-MOPB061} \bibitem{Kako:SRF17-MOPB061} E. Kako \emph{et al.}, \textquotedblleft{Quality Control of Copper Plating in STF-2 Input Power Couplers}\textquotedblright, in \emph{Proc. SRF’17}, Lanzhou, China, Jul. 2017, pp. 186--190. \doi{10.18429/JACoW-SRF2017-MOPB061}

For BibTeX

@inproceedings{holubek:ipac11-thpc160, author = {T. Holubek and others}, title = {{A Superconducting Switch for Insertion Devices with Variable Period Length}}, booktitle = {Proc. IPAC'11}, pages = {3266--3268}, paper = {THPC160}, venue = {San Sebastian, Spain}, series = {International Particle Accelerator Conference}, number = {2}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {9}, year = {2011}, isbn = {978-9-29-083366-6}, url = {https://jacow.org/IPAC2011/papers/THPC160.pdf}, language = {english} } @inproceedings{kako:srf17-mopb061, author = {E. Kako and others}, title = {{Quality Control of Copper Plating in STF-2 Input Power Couplers}}, booktitle = {Proc. SRF'17}, pages = {186--190}, paper = {MOPB061}, venue = {Lanzhou, China, Jul. 2017}, publisher = {JACoW Publishing, Geneva, Switzerland}, doi = {10.18429/JACoW-SRF2017-MOPB061}, url = {https://jacow.org/srf2017/papers/MOPB061.pdf}, language = {english} }

References

• T. Holubek et al., “A Superconducting Switch for Insertion Devices with Variable Period Length”, in Proc. 2nd Int. Particle Accelerator Conf. (IPAC'11), San Sebastian, Spain, Sep. 2011, paper THPC160, pp. 3266-3268.
• E. Kako et al., “Quality Control of Copper Plating in STF-2 Input Power Couplers”, in Proc. 18th Int. Conf. RF Superconductivity (SRF'17), Lanzhou, China, Jul. 2017, pp. 186-190.