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[n]	E. Carlier et al., “Commissioning of the Control System for the LHC Beam Dump Kicker Systems”, in Proc. ICALEPCS'09, Kobe, Japan, Oct. 2009, paper WEC001, pp. 391-393. 

[n]	E. Kako et al., “Quality Control of Copper Plating in STF-2 Input Power Couplers”, in Proc. SRF'17, Lanzhou, China, Jul. 2017, pp. 186-190. doi:10.18429/JACoW-SRF2017-MOPB061

For LaTeX

%\cite{Carlier:ICALEPCS09-WEC001} \bibitem{Carlier:ICALEPCS09-WEC001} E. Carlier \emph{et al.}, \textquotedblleft{Commissioning of the Control System for the LHC Beam Dump Kicker Systems}\textquotedblright, in \emph{Proc. ICALEPCS’09}, Kobe, Japan, Oct. 2009, paper WEC001, pp. 391--393. %\cite{Kako:SRF17-MOPB061} \bibitem{Kako:SRF17-MOPB061} E. Kako \emph{et al.}, \textquotedblleft{Quality Control of Copper Plating in STF-2 Input Power Couplers}\textquotedblright, in \emph{Proc. SRF’17}, Lanzhou, China, Jul. 2017, pp. 186--190. \doi{10.18429/JACoW-SRF2017-MOPB061}

For BibTeX

@inproceedings{carlier:icalepcs09-wec001, author = {E. Carlier and others}, title = {{Commissioning of the Control System for the LHC Beam Dump Kicker Systems}}, booktitle = {Proc. ICALEPCS'09}, pages = {391--393}, paper = {WEC001}, venue = {Kobe, Japan, Oct. 2009}, publisher = {JACoW Publishing, Geneva, Switzerland}, url = {https://jacow.org/icalepcs2009/papers/WEC001.pdf}, language = {english} } @inproceedings{kako:srf17-mopb061, author = {E. Kako and others}, title = {{Quality Control of Copper Plating in STF-2 Input Power Couplers}}, booktitle = {Proc. SRF'17}, pages = {186--190}, paper = {MOPB061}, venue = {Lanzhou, China, Jul. 2017}, publisher = {JACoW Publishing, Geneva, Switzerland}, doi = {10.18429/JACoW-SRF2017-MOPB061}, url = {https://jacow.org/srf2017/papers/MOPB061.pdf}, language = {english} }

References

• E. Carlier et al., “Commissioning of the Control System for the LHC Beam Dump Kicker Systems”, in Proc. 12th Int. Conf. on Accelerator and Large Experimental Physics Control Systems (ICALEPCS'09), Kobe, Japan, Oct. 2009, paper WEC001, pp. 391-393.
• E. Kako et al., “Quality Control of Copper Plating in STF-2 Input Power Couplers”, in Proc. 18th Int. Conf. RF Superconductivity (SRF'17), Lanzhou, China, Jul. 2017, pp. 186-190.