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[n]	M. Nast and S. Tantawi, “Experimental demonstration of particle acceleration with normal conducting accelerating structure at cryogenic temperature”, presented at the IPAC'25, Taipei, Taiwan, Jun. 2025, paper WEXD1, unpublished. 

[n]	A. Sitnikov et al., “Effect of Tin Ion Implantation on the Properties of Amorphous Ge2Sb2Te5 Thin Films”, in Proc. RuPAC'18, Protvino, Russia, Oct. 2018, pp. 230-232. doi:10.18429/JACoW-RUPAC2018-TUPSA41

[n]	A. M. Al-Khateeb, O. Boine-Frankenheim, W. M. Daqa, R. W. Hasse, and I. Hofmann, “Transverse Coupling Impedances From Field Matching in a Smooth Resistive Cylindrical Pipe for Arbitrary Beam Energies”, in Proc. EPAC'06, Edinburgh, UK, Jun. 2006, paper THPCH034, pp. 2853-2855. 

For LaTeX

%\cite{Nast:IPAC25-WEXD1} \bibitem{Nast:IPAC25-WEXD1} M. Nast and S. Tantawi, \textquotedblleft{Experimental demonstration of particle acceleration with normal conducting accelerating structure at cryogenic temperature}\textquotedblright, presented at the IPAC’25, Taipei, Taiwan, Jun. 2025, paper WEXD1, unpublished. %\cite{Sitnikov:RuPAC18-TUPSA41} \bibitem{Sitnikov:RuPAC18-TUPSA41} A. Sitnikov \emph{et al.}, \textquotedblleft{Effect of Tin Ion Implantation on the Properties of Amorphous Ge2Sb2Te5 Thin Films}\textquotedblright, in \emph{Proc. RuPAC’18}, Protvino, Russia, Oct. 2018, pp. 230--232. \doi{10.18429/JACoW-RUPAC2018-TUPSA41} %\cite{Al-Khateeb:EPAC06-THPCH034} \bibitem{Al-Khateeb:EPAC06-THPCH034} A. M. Al-Khateeb, O. Boine-Frankenheim, W. M. Daqa, R. W. Hasse, and I. Hofmann, \textquotedblleft{Transverse Coupling Impedances From Field Matching in a Smooth Resistive Cylindrical Pipe for Arbitrary Beam Energies}\textquotedblright, in \emph{Proc. EPAC’06}, Edinburgh, UK, Jun. 2006, paper THPCH034, pp. 2853--2855.

For BibTeX

@unpublished{nast:ipac25-wexd1, author = {M. Nast and S. Tantawi}, title = {{Experimental demonstration of particle acceleration with normal conducting accelerating structure at cryogenic temperature}}, pages = {}, paper = {WEXD1}, venue = {Taipei, Taiwan, Jun. 2025}, intype = {presented at the}, series = {International Particle Accelerator Conference}, number = {16}, publisher = {JACoW Publishing, Geneva, Switzerland}, note = {presented at IPAC'25, Taipei, Taiwan, Jun. 2025, paper WEXD1, unpublished}, language = {english} } @inproceedings{sitnikov:rupac18-tupsa41, author = {A. Sitnikov and others}, title = {{Effect of Tin Ion Implantation on the Properties of Amorphous Ge2Sb2Te5 Thin Films}}, booktitle = {Proc. RuPAC'18}, pages = {230--232}, paper = {TUPSA41}, venue = {Protvino, Russia, Oct. 2018}, publisher = {JACoW Publishing, Geneva, Switzerland}, doi = {10.18429/JACoW-RUPAC2018-TUPSA41}, url = {https://jacow.org/rupac2018/papers/TUPSA41.pdf}, language = {english} } @inproceedings{al-khateeb:epac06-thpch034, author = {A. M. Al-Khateeb and O. Boine-Frankenheim and W. M. Daqa and R. W. Hasse and I. Hofmann}, title = {{Transverse Coupling Impedances From Field Matching in a Smooth Resistive Cylindrical Pipe for Arbitrary Beam Energies}}, booktitle = {Proc. EPAC'06}, pages = {2853--2855}, paper = {THPCH034}, venue = {Edinburgh, UK}, series = {European Particle Accelerator Conference}, number = {10}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {7}, year = {2006}, language = {english} }

References

• M. Nast and S. Tantawi, “Experimental demonstration of particle acceleration with normal conducting accelerating structure at cryogenic temperature”, presented at the 16th Int. Particle Accelerator Conf. (IPAC'25), Taipei, Taiwan, Jun. 2025, paper WEXD1, this conference.
• A. Sitnikov et al., “Effect of Tin Ion Implantation on the Properties of Amorphous Ge2Sb2Te5 Thin Films”, in Proc. 26th Russian Particle Accelerator Conf. (RuPAC'18), Protvino, Russia, Oct. 2018, pp. 230-232.
• A. M. Al-Khateeb, O. Boine-Frankenheim, W. M. Daqa, R. W. Hasse, and I. Hofmann, “Transverse Coupling Impedances From Field Matching in a Smooth Resistive Cylindrical Pipe for Arbitrary Beam Energies”, in Proc. 10th European Particle Accelerator Conf. (EPAC'06), Edinburgh, UK, Jun. 2006, paper THPCH034, pp. 2853-2855.