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[n]	M. Fujisawa et al., “Reduction In Resistive-Wall Impedance of Insertion-Device Vacuum Chamber By Copper Coating”, in Proc. EPAC'98, Stockholm, Sweden, Jun. 1998, paper THP10H, pp. 984-986. 

[n]	Z. D. Farkas, H. A. Hogg, G. A. Loew, and P. B. Wilson, “Recent Progress on Sled, The SLAC Energy Doubler”, in Proc. PAC'75, Washington D.C., USA, Mar. 1975, pp. 1299-1303. 

[n]	J. F. Zhang et al., “Progresses of the ThomX High Level Control Applications based on MATLAB Middle Layer”, in Proc. IPAC'14, Dresden, Germany, Jun. 2014, pp. 3125-3127. doi:10.18429/JACoW-IPAC2014-THPRO100

[n]	T. J. P. Ellison, O. Dermois, D. L. Friesel, and T. S. Sloan, “Status Report on the Initial Cooling Studies in the IUCF Cooler”, in Proc. EPAC'88, Rome, Italy, Jun. 1988, pp. 547-550. 

For LaTeX

%\cite{Fujisawa:EPAC98-THP10H} \bibitem{Fujisawa:EPAC98-THP10H} M. Fujisawa \emph{et al.}, \textquotedblleft{Reduction In Resistive-Wall Impedance of Insertion-Device Vacuum Chamber By Copper Coating}\textquotedblright, in \emph{Proc. EPAC’98}, Stockholm, Sweden, Jun. 1998, paper THP10H, pp. 984--986. %\cite{Farkas:PAC75} \bibitem{Farkas:PAC75} Z. D. Farkas, H. A. Hogg, G. A. Loew, and P. B. Wilson, \textquotedblleft{Recent Progress on Sled, The SLAC Energy Doubler}\textquotedblright, in \emph{Proc. PAC’75}, Washington D.C., USA, Mar. 1975, pp. 1299--1303. %\cite{Zhang:IPAC14-THPRO100} \bibitem{Zhang:IPAC14-THPRO100} J. F. Zhang \emph{et al.}, \textquotedblleft{Progresses of the ThomX High Level Control Applications based on MATLAB Middle Layer}\textquotedblright, in \emph{Proc. IPAC’14}, Dresden, Germany, Jun. 2014, pp. 3125--3127. \doi{10.18429/JACoW-IPAC2014-THPRO100} %\cite{Ellison:EPAC88} \bibitem{Ellison:EPAC88} T. J. P. Ellison, O. Dermois, D. L. Friesel, and T. S. Sloan, \textquotedblleft{Status Report on the Initial Cooling Studies in the IUCF Cooler}\textquotedblright, in \emph{Proc. EPAC’88}, Rome, Italy, Jun. 1988, pp. 547--550.

For BibTeX

@inproceedings{fujisawa:epac98-thp10h, author = {M. Fujisawa and others}, title = {{Reduction In Resistive-Wall Impedance of Insertion-Device Vacuum Chamber By Copper Coating}}, booktitle = {Proc. EPAC'98}, pages = {984--986}, paper = {THP10H}, venue = {Stockholm, Sweden}, series = {European Particle Accelerator Conference}, number = {6}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {8}, year = {1998}, url = {https://jacow.org/e98/papers/THP10H.pdf}, language = {english} } @inproceedings{farkas:pac75, author = {Z. D. Farkas and H. A. Hogg and G. A. Loew and P. B. Wilson}, title = {{Recent Progress on Sled, The SLAC Energy Doubler}}, booktitle = {Proc. PAC'75}, pages = {1299--1303}, paper = {}, venue = {Washington D.C., USA, Mar. 1975}, publisher = {JACoW Publishing, Geneva, Switzerland}, language = {english} } @inproceedings{zhang:ipac14-thpro100, author = {J. F. Zhang and others}, title = {{Progresses of the ThomX High Level Control Applications based on MATLAB Middle Layer}}, booktitle = {Proc. IPAC'14}, pages = {3125--3127}, paper = {THPRO100}, venue = {Dresden, Germany, Jun. 2014}, publisher = {JACoW Publishing, Geneva, Switzerland}, doi = {10.18429/JACoW-IPAC2014-THPRO100}, url = {https://jacow.org/IPAC2014/papers/THPRO100.pdf}, language = {english} } @inproceedings{ellison:epac88, author = {T. J. P. Ellison and O. Dermois and D. L. Friesel and T. S. Sloan}, title = {{Status Report on the Initial Cooling Studies in the IUCF Cooler}}, booktitle = {Proc. EPAC'88}, pages = {547--550}, paper = {}, venue = {Rome, Italy, Jun. 1988}, series = {European Particle Accelerator Conference}, number = {1}, publisher = {JACoW Publishing, Geneva, Switzerland}, language = {english} }

References

• M. Fujisawa et al., “Reduction In Resistive-Wall Impedance of Insertion-Device Vacuum Chamber By Copper Coating”, in Proc. 6th European Particle Accelerator Conf. (EPAC'98), Stockholm, Sweden, Jun. 1998, paper THP10H, pp. 984-986.
• Z. D. Farkas, H. A. Hogg, G. A. Loew, and P. B. Wilson, “Recent Progress on Sled, The SLAC Energy Doubler”, in Proc. 6th Particle Accelerator Conf. (PAC'75), Washington D.C., USA, Mar. 1975, pp. 1299-1303.
• J. F. Zhang et al., “Progresses of the ThomX High Level Control Applications based on MATLAB Middle Layer”, in Proc. 5th Int. Particle Accelerator Conf. (IPAC'14), Dresden, Germany, Jun. 2014, pp. 3125-3127.
• T. J. P. Ellison, O. Dermois, D. L. Friesel, and T. S. Sloan, “Status Report on the Initial Cooling Studies in the IUCF Cooler”, in Proc. 1st European Particle Accelerator Conf. (EPAC'88), Rome, Italy, Jun. 1988, pp. 547-550.