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[n]	T. Chen, W. Li, and Y. J. Pei, “Design of the Condenser System and Imaging System for a UEM”, in Proc. IPAC'19, Melbourne, Australia, May 2019, pp. 3485-3487. doi:10.18429/JACoW-IPAC2019-THPMP016

[n]	F. Sciarrabba et al., “1.3 GHz Seamless Copper Cavities via CNC Spinning Technique”, in Proc. SRF'21, East Lansing, MI, USA, Jun.-Jul. 2021, pp. 440. doi:10.18429/JACoW-SRF2021-TUPCAV003

For LaTeX

%\cite{Chen:IPAC19-THPMP016} \bibitem{Chen:IPAC19-THPMP016} T. Chen, W. Li, and Y. J. Pei, \textquotedblleft{Design of the Condenser System and Imaging System for a UEM}\textquotedblright, in \emph{Proc. IPAC’19}, Melbourne, Australia, May 2019, pp. 3485--3487. \doi{10.18429/JACoW-IPAC2019-THPMP016} %\cite{Sciarrabba:SRF21-TUPCAV003} \bibitem{Sciarrabba:SRF21-TUPCAV003} F. Sciarrabba \emph{et al.}, \textquotedblleft{1.3 GHz Seamless Copper Cavities via CNC Spinning Technique}\textquotedblright, in \emph{Proc. SRF’21}, East Lansing, MI, USA, Jun.-Jul. 2021, pp. 440. \doi{10.18429/JACoW-SRF2021-TUPCAV003}

For BibTeX

@inproceedings{chen:ipac19-thpmp016, author = {T. Chen and W. Li and Y. J. Pei}, title = {{Design of the Condenser System and Imaging System for a UEM}}, booktitle = {Proc. IPAC'19}, pages = {3485--3487}, paper = {THPMP016}, venue = {Melbourne, Australia, May 2019}, publisher = {JACoW Publishing, Geneva, Switzerland}, doi = {10.18429/JACoW-IPAC2019-THPMP016}, url = {http://accelconf.web.cern.ch/ipac2019/papers/THPMP016.pdf}, language = {english} } @inproceedings{sciarrabba:srf21-tupcav003, author = {F. Sciarrabba and others}, title = {{1.3 GHz Seamless Copper Cavities via CNC Spinning Technique}}, booktitle = {Proc. SRF'21}, pages = {440}, paper = {TUPCAV003}, venue = {East Lansing, MI, USA}, series = {International Conference on RF Superconductivity}, number = {20}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {10}, year = {2022}, issn = {2673-5504}, isbn = {978-3-95-450233-2}, doi = {10.18429/JACoW-SRF2021-TUPCAV003}, url = {https://jacow.org/srf2021/papers/TUPCAV003.pdf}, language = {english} }

References

• T. Chen, W. Li, and Y. J. Pei, “Design of the Condenser System and Imaging System for a UEM”, in Proc. 10th Int. Particle Accelerator Conf. (IPAC'19), Melbourne, Australia, May 2019, pp. 3485-3487.
• F. Sciarrabba et al., “1.3 GHz Seamless Copper Cavities via CNC Spinning Technique”, in Proc. 20th International Conference on RF Superconductivity (SRF'21), East Lansing, MI, USA, Jun.-Jul. 2021, pp. 440.