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[n]	M. Fujisawa et al., “Reduction In Resistive-Wall Impedance of Insertion-Device Vacuum Chamber By Copper Coating”, in Proc. EPAC'98, Stockholm, Sweden, Jun. 1998, paper THP10H, pp. 984-986. 

For LaTeX

%\cite{Fujisawa:EPAC98-THP10H} \bibitem{Fujisawa:EPAC98-THP10H} M. Fujisawa \emph{et al.}, \textquotedblleft{Reduction In Resistive-Wall Impedance of Insertion-Device Vacuum Chamber By Copper Coating}\textquotedblright, in \emph{Proc. EPAC’98}, Stockholm, Sweden, Jun. 1998, paper THP10H, pp. 984--986.

For BibTeX

@inproceedings{fujisawa:epac98-thp10h, author = {M. Fujisawa and others}, title = {{Reduction In Resistive-Wall Impedance of Insertion-Device Vacuum Chamber By Copper Coating}}, booktitle = {Proc. EPAC'98}, pages = {984--986}, paper = {THP10H}, venue = {Stockholm, Sweden}, series = {European Particle Accelerator Conference}, number = {6}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {8}, year = {1998}, url = {https://jacow.org/e98/papers/THP10H.pdf}, language = {english} }

References

• M. Fujisawa et al., “Reduction In Resistive-Wall Impedance of Insertion-Device Vacuum Chamber By Copper Coating”, in Proc. 6th European Particle Accelerator Conf. (EPAC'98), Stockholm, Sweden, Jun. 1998, paper THP10H, pp. 984-986.