Reference Search

Favourites

For Word

[n]	A. Facco et al., “Studies on a 100 MeV/A Superconducting Post-accelerator Linac for EURISOL”, in Proc. EPAC'02, Paris, France, Jun. 2002, paper THPLE040, pp. 891-893. 

[n]	M. Katoh, M. Hosaka, A. Mochihashi, J. Yamazaki, and K. Hayashi, “Status of UVSOR-II”, in Proc. APAC'04, Gyeongju, Korea, Mar. 2004, paper TUP14010, pp. XX-XX. 

[n]	H. Tomizawa, H. Dewa, H. Hanaki, A. Mizuno, and T. Taniuchi, “Development of a High-Pressure Chemical Etching Method as a Surface Treatment for High-Field Accelerating Structures Made of Copper”, in Proc. LINAC'08, Victoria, Canada, Sep.-Oct. 2008, paper THP052, pp. 903-905. 

[n]	D. Kim, S. Biedron, Z. Li, and E. I. Simakov, “Design Study of HOM Couplers for the C-Band Accelerating Structure”, in Proc. IPAC'22, Bangkok, Thailand, Jun. 2022, pp. 1561-1563. doi:10.18429/JACoW-IPAC2022-TUPOMS057

[n]	S. Sampayan et al., “Development of a Compact Radiography Accelerator Using Dielectric Wall Accelerator Technology”, in Proc. PAC'05, Knoxville, TN, USA, May 2005, paper ROAB010, pp. 716-718. 

[n]	A. Sulc et al., “eLog analysis for accelerators: status and future outlook”, in Proc. IPAC'25, Taipei, Taiwan, Jun. 2025, pp. 3076-3079. doi:10.18429/JACoW-IPAC2025-THPS048

For LaTeX

%\cite{Facco:EPAC02-THPLE040} \bibitem{Facco:EPAC02-THPLE040} A. Facco \emph{et al.}, \textquotedblleft{Studies on a 100 MeV/A Superconducting Post-accelerator Linac for EURISOL}\textquotedblright, in \emph{Proc. EPAC’02}, Paris, France, Jun. 2002, paper THPLE040, pp. 891--893. %\cite{Katoh:APAC04-TUP14010} \bibitem{Katoh:APAC04-TUP14010} M. Katoh, M. Hosaka, A. Mochihashi, J. Yamazaki, and K. Hayashi, \textquotedblleft{Status of UVSOR-II}\textquotedblright, in \emph{Proc. APAC’04}, Gyeongju, Korea, Mar. 2004, paper TUP14010, pp. XX--XX. %\cite{Tomizawa:LINAC08-THP052} \bibitem{Tomizawa:LINAC08-THP052} H. Tomizawa, H. Dewa, H. Hanaki, A. Mizuno, and T. Taniuchi, \textquotedblleft{Development of a High-Pressure Chemical Etching Method as a Surface Treatment for High-Field Accelerating Structures Made of Copper}\textquotedblright, in \emph{Proc. LINAC’08}, Victoria, Canada, Sep.-Oct. 2008, paper THP052, pp. 903--905. %\cite{Kim:IPAC22-TUPOMS057} \bibitem{Kim:IPAC22-TUPOMS057} D. Kim, S. Biedron, Z. Li, and E. I. Simakov, \textquotedblleft{Design Study of HOM Couplers for the C-Band Accelerating Structure}\textquotedblright, in \emph{Proc. IPAC’22}, Bangkok, Thailand, Jun. 2022, pp. 1561--1563. \doi{10.18429/JACoW-IPAC2022-TUPOMS057} %\cite{Sampayan:PAC05-ROAB010} \bibitem{Sampayan:PAC05-ROAB010} S. Sampayan \emph{et al.}, \textquotedblleft{Development of a Compact Radiography Accelerator Using Dielectric Wall Accelerator Technology}\textquotedblright, in \emph{Proc. PAC’05}, Knoxville, TN, USA, May 2005, paper ROAB010, pp. 716--718. %\cite{Sulc:IPAC25-THPS048} \bibitem{Sulc:IPAC25-THPS048} A. Sulc \emph{et al.}, \textquotedblleft{eLog analysis for accelerators: status and future outlook}\textquotedblright, in \emph{Proc. IPAC’25}, Taipei, Taiwan, Jun. 2025, pp. 3076--3079. \doi{10.18429/JACoW-IPAC2025-THPS048}

For BibTeX

@inproceedings{facco:epac02-thple040, author = {A. Facco and others}, title = {{Studies on a 100 MeV/A Superconducting Post-accelerator Linac for EURISOL}}, booktitle = {Proc. EPAC'02}, pages = {891--893}, paper = {THPLE040}, venue = {Paris, France}, series = {European Particle Accelerator Conference}, number = {8}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {8}, year = {2007}, url = {https://jacow.org/e02/papers/THPLE040.pdf}, language = {english} } @inproceedings{katoh:apac04-tup14010, author = {M. Katoh and M. Hosaka and A. Mochihashi and J. Yamazaki and K. Hayashi}, title = {{Status of UVSOR-II}}, booktitle = {Proc. APAC'04}, paper = {TUP14010}, venue = {Gyeongju, Korea, Mar. 2004}, publisher = {JACoW Publishing, Geneva, Switzerland}, url = {https://jacow.org/a04/papers/TUP14010.pdf}, language = {english} } @inproceedings{tomizawa:linac08-thp052, author = {H. Tomizawa and H. Dewa and H. Hanaki and A. Mizuno and T. Taniuchi}, title = {{Development of a High-Pressure Chemical Etching Method as a Surface Treatment for High-Field Accelerating Structures Made of Copper}}, booktitle = {Proc. LINAC'08}, pages = {903--905}, paper = {THP052}, venue = {Victoria, Canada, Sep.-Oct. 2008}, series = {Linear Accelerator Conference}, number = {24}, publisher = {JACoW Publishing, Geneva, Switzerland}, url = {https://jacow.org/LINAC08/papers/THP052.pdf}, language = {english} } @inproceedings{kim:ipac22-tupoms057, author = {D. Kim and S. Biedron and Z. Li and E. I. Simakov}, title = {{Design Study of HOM Couplers for the C-Band Accelerating Structure}}, booktitle = {Proc. IPAC'22}, pages = {1561--1563}, paper = {TUPOMS057}, venue = {Bangkok, Thailand}, series = {International Particle Accelerator Conference}, number = {13}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {7}, year = {2022}, issn = {2673-5490}, isbn = {978-3-95-450227-1}, doi = {10.18429/JACoW-IPAC2022-TUPOMS057}, url = {https://jacow.org/IPAC2022/papers/TUPOMS057.pdf}, language = {english} } @inproceedings{sampayan:pac05-roab010, author = {S. Sampayan and others}, title = {{Development of a Compact Radiography Accelerator Using Dielectric Wall Accelerator Technology}}, booktitle = {Proc. PAC'05}, pages = {716--718}, paper = {ROAB010}, venue = {Knoxville, TN, USA, May 2005}, series = {Particle Accelerator Conference}, number = {21}, publisher = {JACoW Publishing, Geneva, Switzerland}, url = {https://jacow.org/p05/papers/ROAB010.pdf}, language = {english} } @inproceedings{sulc:ipac25-thps048, author = {A. Sulc and others}, title = {{eLog analysis for accelerators: status and future outlook}}, booktitle = {Proc. IPAC'25}, pages = {3076--3079}, paper = {THPS048}, venue = {Taipei, Taiwan}, series = {International Particle Accelerator Conference}, number = {16}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {11}, year = {2025}, issn = {2673-5490}, isbn = {978-3-95-450248-6}, doi = {10.18429/JACoW-IPAC2025-THPS048}, language = {english} }

References

• A. Facco et al., “Studies on a 100 MeV/A Superconducting Post-accelerator Linac for EURISOL”, in Proc. 8th European Particle Accelerator Conf. (EPAC'02), Paris, France, Jun. 2002, paper THPLE040, pp. 891-893.
• M. Katoh, M. Hosaka, A. Mochihashi, J. Yamazaki, and K. Hayashi, “Status of UVSOR-II”, in Proc. 3rd Asian Particle Accelerator Conf. (APAC'04), Gyeongju, Korea, Mar. 2004, paper TUP14010, pp. XX-XX.
• H. Tomizawa, H. Dewa, H. Hanaki, A. Mizuno, and T. Taniuchi, “Development of a High-Pressure Chemical Etching Method as a Surface Treatment for High-Field Accelerating Structures Made of Copper”, in Proc. 24th Linear Accelerator Conf. (LINAC'08), Victoria, Canada, Sep.-Oct. 2008, paper THP052, pp. 903-905.
• D. Kim, S. Biedron, Z. Li, and E. I. Simakov, “Design Study of HOM Couplers for the C-Band Accelerating Structure”, in Proc. 13th Int. Particle Accelerator Conf. (IPAC'22), Bangkok, Thailand, Jun. 2022, pp. 1561-1563.
• S. Sampayan et al., “Development of a Compact Radiography Accelerator Using Dielectric Wall Accelerator Technology”, in Proc. 21st Particle Accelerator Conf. (PAC'05), Knoxville, TN, USA, May 2005, paper ROAB010, pp. 716-718.
• A. Sulc et al., “eLog analysis for accelerators: status and future outlook”, in Proc. 16th Int. Particle Accelerator Conf. (IPAC'25), Taipei, Taiwan, Jun. 2025, paper THPS048, pp. 3076-3079.