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[n]	D. Perez, R. Shinohara, S. Bagchi, C. Huang, E. Simakov, and G. Wang, “Multiscale material design of robust semiconductor photocathodes under strong fields”, presented at the IPAC'23, Venice, Italy, May 2023, paper TUPA017, unpublished. 

For LaTeX

%\cite{Perez:IPAC23-TUPA017} \bibitem{Perez:IPAC23-TUPA017} D. Perez, R. Shinohara, S. Bagchi, C. Huang, E. Simakov, and G. Wang, \textquotedblleft{Multiscale material design of robust semiconductor photocathodes under strong fields}\textquotedblright, presented at the IPAC’23, Venice, Italy, May 2023, paper TUPA017, unpublished.

For BibTeX

@unpublished{perez:ipac23-tupa017, author = {D. Perez and R. Shinohara and S. Bagchi and C. Huang and E. Simakov and G. Wang}, title = {{Multiscale material design of robust semiconductor photocathodes under strong fields}}, booktitle = {Proc. IPAC'23}, pages = {}, paper = {TUPA017}, venue = {Venice, Italy}, intype = {presented at the}, series = {International Particle Accelerator Conference}, number = {14}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {9}, year = {2023}, issn = {2673-5490}, isbn = {978-3-95-450231-8}, note = {presented at IPAC'23, Venice, Italy, May 2023, paper TUPA017, unpublished}, language = {english} }

References

• D. Perez, R. Shinohara, S. Bagchi, C. Huang, E. Simakov, and G. Wang, “Multiscale material design of robust semiconductor photocathodes under strong fields”, presented at the 14th Int. Particle Accelerator Conf. (IPAC'23), Venice, Italy, May 2023, paper TUPA017, unpublished.