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[n]	C. Pira et al., “Plasma Electrolytic Polishing as a Promising Treatment Replacement of Electropolishing in the Copper and Niobium Substrate Preparation for SRF”, in Proc. SRF'21, East Lansing, MI, USA, Jun.-Jul. 2021, pp. 718. doi:10.18429/JACoW-SRF2021-THOTEV06

For LaTeX

%\cite{Pira:SRF21-THOTEV06} \bibitem{Pira:SRF21-THOTEV06} C. Pira \emph{et al.}, \textquotedblleft{Plasma Electrolytic Polishing as a Promising Treatment Replacement of Electropolishing in the Copper and Niobium Substrate Preparation for SRF}\textquotedblright, in \emph{Proc. SRF’21}, East Lansing, MI, USA, Jun.-Jul. 2021, pp. 718. \url{doi:10.18429/JACoW-SRF2021-THOTEV06}

For BibTeX

@inproceedings{pira:srf21-thotev06, author = {C. Pira and others}, title = {{Plasma Electrolytic Polishing as a Promising Treatment Replacement of Electropolishing in the Copper and Niobium Substrate Preparation for SRF}}, booktitle = {Proc. SRF'21}, pages = {718}, paper = {THOTEV06}, venue = {East Lansing, MI, USA}, series = {International Conference on RF Superconductivity}, number = {20}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {10}, year = {2022}, issn = {2673-5504}, isbn = {978-3-95-450233-2}, doi = {10.18429/JACoW-SRF2021-THOTEV06}, url = {https://jacow.org/srf2021/papers/THOTEV06.pdf}, language = {english} }

References

• C. Pira et al., “Plasma Electrolytic Polishing as a Promising Treatment Replacement of Electropolishing in the Copper and Niobium Substrate Preparation for SRF”, in Proc. 20th International Conference on RF Superconductivity (SRF'21), East Lansing, MI, USA, Jun.-Jul. 2021, pp. 718.