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[n]	Z. Sun et al., “Electroplating of Sn Film on Nb Substrate for Generating Nb?Sn Thin Films and Post Laser Annealing”, in Proc. SRF'19, Dresden, Germany, Jun.-Jul. 2019, pp. 51-54. doi:10.18429/JACoW-SRF2019-MOP014

[n]	J. Y. Yang, “DC high voltage electron gun development of the Dalian Advanced Light source pre-research project”, presented at the SAP'23, Xichang, China, Jul. 2023, paper TUIBA01, unpublished. 

[n]	K. Vodopivec, J. E. Breeding, and J. W. Sinclair, “The Linux Device Driver Framework for High-Throughput Lossless Data Streaming Applications”, in Proc. ICALEPCS'19, New York, NY, USA, Oct. 2019, pp. 603. doi:10.18429/JACoW-ICALEPCS2019-MOPHA156

For LaTeX

%\cite{Sun:SRF19-MOP014} \bibitem{Sun:SRF19-MOP014} Z. Sun \emph{et al.}, \textquotedblleft{Electroplating of Sn Film on Nb Substrate for Generating Nb?Sn Thin Films and Post Laser Annealing}\textquotedblright, in \emph{Proc. SRF’19}, Dresden, Germany, Jun.-Jul. 2019, pp. 51--54. \doi{10.18429/JACoW-SRF2019-MOP014} %\cite{Yang:SAP23-TUIBA01} \bibitem{Yang:SAP23-TUIBA01} J. Y. Yang, \textquotedblleft{DC high voltage electron gun development of the Dalian Advanced Light source pre-research project}\textquotedblright, presented at the SAP’23, Xichang, China, Jul. 2023, paper TUIBA01, unpublished. %\cite{Vodopivec:ICALEPCS19-MOPHA156} \bibitem{Vodopivec:ICALEPCS19-MOPHA156} K. Vodopivec, J. E. Breeding, and J. W. Sinclair, \textquotedblleft{The Linux Device Driver Framework for High-Throughput Lossless Data Streaming Applications}\textquotedblright, in \emph{Proc. ICALEPCS’19}, New York, NY, USA, Oct. 2019, pp. 603. \doi{10.18429/JACoW-ICALEPCS2019-MOPHA156}

For BibTeX

@inproceedings{sun:srf19-mop014, author = {Z. Sun and others}, title = {{Electroplating of Sn Film on Nb Substrate for Generating Nb?Sn Thin Films and Post Laser Annealing}}, booktitle = {Proc. SRF'19}, pages = {51--54}, paper = {MOP014}, venue = {Dresden, Germany, Jun.-Jul. 2019}, publisher = {JACoW Publishing, Geneva, Switzerland}, doi = {10.18429/JACoW-SRF2019-MOP014}, url = {https://jacow.org/srf2019/papers/MOP014.pdf}, language = {english} } @unpublished{yang:sap23-tuiba01, author = {J. Y. Yang}, title = {{DC high voltage electron gun development of the Dalian Advanced Light source pre-research project}}, booktitle = {Proc. SAP'23}, pages = {}, paper = {TUIBA01}, venue = {Xichang, China}, intype = {presented at the}, series = {Symposium on Accelerator Physics}, number = {14}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {12}, year = {2024}, isbn = {978-3-95-450265-3}, note = {presented at SAP'23, Xichang, China, Jul. 2023, paper TUIBA01, unpublished}, language = {english} } @inproceedings{vodopivec:icalepcs19-mopha156, author = {K. Vodopivec and J. E. Breeding and J. W. Sinclair}, title = {{The Linux Device Driver Framework for High-Throughput Lossless Data Streaming Applications}}, booktitle = {Proc. ICALEPCS'19}, pages = {603}, paper = {MOPHA156}, venue = {New York, NY, USA}, series = {International Conference on Accelerator and Large Experimental Physics Control Systems}, number = {17}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {10}, year = {2020}, issn = {2226-0358}, isbn = {978-3-95-450209-7}, doi = {10.18429/JACoW-ICALEPCS2019-MOPHA156}, url = {https://jacow.org/icalepcs2019/papers/MOPHA156.pdf}, language = {english} }

References

• Z. Sun et al., “Electroplating of Sn Film on Nb Substrate for Generating Nb?Sn Thin Films and Post Laser Annealing”, in Proc. 19th Int. Conf. RF Superconductivity (SRF'19), Dresden, Germany, Jun.-Jul. 2019, pp. 51-54.
• J. Y. Yang, “DC high voltage electron gun development of the Dalian Advanced Light source pre-research project”, presented at the 14th Symposium on Accelerator Physics (SAP'23), Xichang, China, Jul. 2023, paper TUIBA01, unpublished.
• K. Vodopivec, J. E. Breeding, and J. W. Sinclair, “The Linux Device Driver Framework for High-Throughput Lossless Data Streaming Applications”, in Proc. 17th Int. Conf. on Accelerator and Large Experimental Physics Control Systems (ICALEPCS'19), New York, NY, USA, Oct. 2019, pp. 603.